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Semiconductor

Semiconductor

Laser systems for wafer serialization, marking and scribing

Semiconductor wafer processing typically requires serialization, patterning and roughening operations. And picking the correct laser system for these operations can be complex once you consider all the relevant process variables—such as substrate type, wafer diameter, feature size, slag tolerances, debris volume, throughput and clean room protocols.

Whether marking or cutting wafers, lasers bring distinct advantages and cost savings to semiconductor manufacturing. The non-contact and low-residual processes are necessary in marking everything from blank silicon wafers to completed, packaged devices.

CMS Laser’s wafer processing systems offer a wide range of solutions including serialization for traceability, scribing and lapping. Our laser systems can process the full range of semiconductor substrates and coatings—include silicon, sapphire, lithium tantalate, silicon carbide, III-V semiconductors, II-VI semiconductors, and photo resists.

Our engineers understand the nuances of wafer handling, throughput and clean room requirements. They have experience with a wide variety of substrate types—silicon, sapphire, GaAS, InP, SiGe and more.

We can tailor turnkey laser systems to your application requirements, accounting for geometric, dimensional, line width and slag tolerances.

Laser System Options

Ultraviolet Lasers

The UV Laser system (355nm) offers the best solution when process tolerances are the most important factor. This system allows geometries and line widths below 5 micron in dimensions and processing with minimal to no slag.

Fiber Lasers

These systems produce less particulate than the CO2 Laser System and thus are acceptable for standard fabrication cleanrooms.

CO2 Lasers

The CO2 Laser System offers an economical solution suitable for serialization and dicing for use in higher class cleanrooms, when larger geometries and line widths are acceptable and slag is not a major concern.

Femtosecond Lasers

New ultrafast lasers offer true “cold marking” processes and excel in areas where nanosecond lasers fail. These lasers are ideal for certain processing requirements.

System Examples

The UV Laser System (355nm or 266nm) is an excellent solution when process tolerances or small features are the most important deciding factor. A UV system with galvanometers and a reasonable scan field size, etches with minimal melting and microns wide line widths. This system also reduces particulate generation, especially when marking inside transparent substrates, such that it is acceptable for today’s most stringent clean room protocol.

The Fiber Laser System (1064nm) works well with opaque substrates and larger feature sizes. With the proper laser, technique, and settings, “soft” marks (no debris) on silicon substrates are possible.

The CO2 Laser System offers an economical solution suitable for serialization when larger line widths are acceptable and slag is not a major concern.

The Femotsecond Laser System is the system of choice when true “cold marking” is required. This system is the most costly, but etchings have no raised edges or melting. Because of non-linear absorption, longer wavelengths (1040nm and 520nm) can mark transparent substrates both externally and internally. These lasers generally have high repetition frequencies that allow for faster processing.

Videos

Cassette to Cassette Robotic Operation with Pre-aligner

Laser Marking System for Wafers using a Robot

Images

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For free sample development and analysis, contact our APPLICATIONS LAB. We’ll match the best laser and optics configuration to meet your manufacturing requirements.

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