Mainstream depaneling methods utilize routers, die cutters and dicing saws. But as boards become thinner, smaller and more sophisticated, these methods expose PCB parts to mechanical stress—resulting in board breakage and lowering throughput.

Other challenges include:

• Lower quality of cuts
• PCB damage due to accumulated debris
• Constant need for new bits, dies and blades
• Not useful for boards < 500 µ
• Design limitation—inability to cut complex, multidimensional PCBs

Laser depaneling systems overcome these challenges while offering greater precision, speed and accuracy. Unlike traditional depaneling techniques, they eliminate mechanical stress to the PCB—resulting in higher throughput.

Lasers make clean, burr-free and precise cuts against the edge of circuits and other important components—improving overall design flexibility without damaging the substrate. Because you don’t have to reorder parts or sharpen bits and blade, laser systems are also more cost effective.

CMS Laser is one of the few companies to provide laser depaneling systems with optical recognition. If your panel isn’t set correctly, this feature will stop the program from starting until the correction is made—reducing downtime, improving product quality and lowering your overall costs.