Die Marking Systems |
|
![]() The laser system. |
![]() A typical wafer die mark. Linewidth = .150mm Character height = 2.50mm |
![]() The frequency doubled Nd:YAG laser beam. |
![]() A fixtured silicon wafer is ready for die marking. |
|
|
|
|
|
|
Die Marking Systems |
|
![]() The laser system. |
![]() A typical wafer die mark. Linewidth = .150mm Character height = 2.50mm |
![]() The frequency doubled Nd:YAG laser beam. |
![]() A fixtured silicon wafer is ready for die marking. |
|
|
|
|
|
|

![]()