Wafer Die Marking Systems

Wafer die marking laser system.

The die marking laser system.

A typical wafer die mark.

A typical wafer die mark.
Linewidth = .150mm
Character height = 2.50mm

Frequency doubled Nd:YAG laser beam.

The frequency doubled Nd:YAG laser beam.

A fixtured wafer ready for die marking.

A fixtured silicon wafer is ready for die marking.

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