Die Marking Systems
Wafer die marking laser system.
The laser system.

A typical wafer die mark.
A typical wafer die mark.
Linewidth = .150mm
Character height = 2.50mm

Frequency doubled Nd:YAG laser beam.
The frequency doubled Nd:YAG laser beam.		 A fixtured wafer ready for die marking.
A fixtured silicon wafer is ready for die marking.
Wafer ID Marking | Die Alignment & Measurement | Wafer Dicing | Get Literature

Laser Marking solutions from CMS Control Micro Systems Corporate Website Receive written information about CMS and our products Customer support hours and contact information Contact CMS
Laser

Control Micro Systems, 4420 Metric Drive, Winter Park, Florida 32792, Phone 407-679-9716

Control Micro Systems, 4420 Metric Drive, Winter Park, Florida 32792, Phone 407-679-9716

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