Laser Wafer Dicing Systems

Wafer Scribing & Dicing

Control Micro System develops creative solutions to cut, scribe and dice a large variety of wafers. Our laser machining systems provide:

• 4.5-watt TEMoo Mode frequency tripled Nd:YVO4 laser
• 16-bit high precision galvanometer system
• Three-pin wafer alignment guides
• Two-position rotary table
• Robot wafer transport
• High resolution working field from 0.5" to 16"
• Fume extraction system
• Line widths as small as 2 um
• Processing of wafers as thin as 50um
• Cutting of wafers as large as 300mm

Kerfwidth: 30 um
Scribed depth: 510 um
Unit size: 2.54 mm x 3.81 mm