Laser Wafer Dicing Systems

Wafer before scribing.
A typical 6" silicon wafer with 670um thickness

Wafer Scribing & Dicing
Control Micro System develops creative solutions to cut, scribe and dice a large variety of wafers. Our laser machining systems provide:
  • 4.5-watt TEMoo Mode frequency tripled Nd:YVO4 laser
  • 16-bit high precision galvanometer system
  • Three-pin wafer alignment guides
  • Two-position rotary table
  • Robot wafer transport
  • High resolution working field from 0.5" to 16"
  • Fume extraction system
  • Line widths as small as 2 um
  • Processing of wafers as thin as 50um
  • Cutting of wafers as large as 300mm
A scribed wafer segment and final dies.
After scribing with the frequency tripled Nd:YVO4 laser

Kerfwidth: 30 um
Scribed depth: 510 um
Unit size: 2.54 mm x 3.81 mm


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Control Micro Systems, 4420 Metric Drive, Winter Park, Florida 32792, Phone 407-679-9716

Control Micro Systems, 4420 Metric Drive, Winter Park, Florida 32792, Phone 407-679-9716

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