Wafer Dicing Laser Systems
A typical 6" silicon wafer with 670um thickness
Wafer Scribing & Dicing
Control Micro System develops creative solutions to cut, scribe and dice a large variety of wafers. Our laser machining systems provide:
4.5-watt TEMoo Mode frequency tripled Nd:YVO4 laser
16-bit high precision galvanometer system
Three-pin wafer alignment guides
Two-position rotary table
Robot wafer transport
High resolution working field from 0.5" to 16"
Fume extraction system
Line widths as small as 2 um
Processing of wafers as thin as 50um
Cutting of wafers as large as 300mm
After scribing with the frequency tripled Nd:YVO4 laser
Kerfwidth:
30 um
Scribed depth:
510 um
Unit size:
2.54 mm x 3.81 mm
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