Wafer Marking/Scribing Systems

Emerging technologies require processing advances. As such, the new Lithium Tantalate (LiTaO3) wafers require a shorter wavelength laser for processing in regards to the traditional silicon or other compound substrates.  CMS has experience in successfully  marking this emerging new compound. If you are working with LiTaO3  and would like to investigate this new marking approach, fill out our application request form and send in your LiTaO3 wafers for processing in our Applications Laboratory.

Do you need to track your product from wafer to component? CMS has over 20 years experience in the wafer engraving industry, utilizing Frequency Doubled Nd:YAG lasers with custom optics and high speed X/Y galvanometer systems to provide the speed and flexibility required for this dynamic market.

Our system allows for complete control over the serialization process to provide you the highest quality mark possible.

Download Free Marking Tutorial
Free Laser Marking Tutorial
Wafer ID laser marking systems.
Wafer die laser marking system
Wafer alignment and measuring station
Wafer dicing.

Wafer ID Marking | Die Marking | Die Alignment & Measurement | Wafer Dicing | Get Literature

Laser Marking solutions from CMS Control Micro Systems Corporate Website Receive written information about CMS and our products Customer support hours and contact information Contact CMS
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Control Micro Systems, 4420 Metric Drive, Winter Park, Florida 32792, Phone 407-679-9716

Control Micro Systems, 4420 Metric Drive, Winter Park, Florida 32792, Phone 407-679-9716

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