Wafer processing typically requires serialization, patterning, or roughening. When determining the correct system for your application, many processing variables must be considered, such as; substrate type, wafer diameter, feature size, slag tolerances, debris volume, throughput, and clean room protocols. Typical substrates and coatings processed by Control Micro Systems are: silicon, sapphire, lithium tantalate, silicon carbide, III-V semiconductors, II-VI semiconductors, and photo resists.
Some examples of the systems offered and their benefits include:
- The UV Laser System (355nm or 266nm) is an excellent solution when process tolerances or small features are the most important deciding factor. A UV system with galvanometers and a reasonable scan field size, etches with minimal melting and microns wide line widths. This system also reduces particulate generation, especially when marking inside transparent substrates, such that it is acceptable for today’s most stringent clean room protocol.
- The 532nm Laser System has similar benefits of the UV laser systems on some substrates, but with larger line widths and reduced cost.
- The Fiber Laser System (1064nm) works well with opaque substrates and larger feature sizes. With the proper laser, technique, and settings, “soft” marks (no debris) on silicon substrates are possible.
- The CO2 Laser System offers an economical solution suitable for serialization when larger line widths are acceptable and slag is not a major concern.
- The Femotsecond Laser System is the system of choice when true “cold marking” is required. This system is the most costly, but etchings have no raised edges or melting. Because of non-linear absorption, longer wavelengths (1040nm and 520nm) can mark transparent substrates both externally and internally. These lasers generally have high repetition frequencies that allow for faster processing. .