Wafer Marking & Cutting
Whether marking or cutting wafers and/or die, lasers have distinct advantages and cost savings over any other methods previously used in semiconductor manufacturing. The non-contact and low residual processes are required in marking everything from blank silicon wafers to completed, packaged devices.
CMS Laser’s wafer processing systems offer a wide range of solutions including serialization for traceability, scribing, and lapping. All are uniquely tailored to your specific requirements. As we develop
your system we gather those requirements like geometrics, dimensions, line width, slag tolerances, and clean room protocols to ensure it meets and exceeds all necessary standards. Our engineers are highly experienced in taking into account the substrate used (e.g. silicon, sapphire, or compound (GaAS, InP, SiGe etc.)), wafer handling needs, and desired throughput to design a turnkey laser wafer system that outperforms your expectations.
Laser Options for Wafer Systems
The CO2 Laser System offers an economical solution suitable for serialization and dicing. They are designed for use in higher class clean rooms where larger geometries and line widths (125 micron) are acceptable and slag is not a major concern. One benefit of the CO2 system is that allows for deeper scribe lines with a single pass as compared to other lasers. The CMS Laser CO2 systems require no laser maintenance for increased uptime.
Fiber Systems provide solutions where tighter tolerances are required than CO2 lasers can offer. These systems have processing capabilities in the 20-30 micron range for improved line width, geometry size, and improved slag tolerances. They also produce less particulate than the CO2 systems, making them acceptable for standard fabrication clean rooms in the Class 100 range.
These systems also provide deeper scribe lines at lower power than the 532, 355, and 266 systems, should scribing and lapping be desired. In addition, the fiber laser system is a “no laser maintenance” solution.
The 532 UV system offers reduced line widths in the 15 micron range, as well as deeper etch capabilities at lower power than the 355 and 266 UV systems.
The 355 and 266 UV systems offer a superior solution when process tolerances are the determining factor. It allows geometries and line widths below 10 microns, and processes with minimal to no slag. These systems also reduce particulate generation allowing for use in today’s most stringent clean room protocols.