Semiconductor Wafer Serialization Marking & Scribing Laser Systems

Semiconductor Wafer Serialization Marking & Scribing Laser Systems

At Control Micro Systems we combine our years of experience with a variety of disciplines to provide a turn-key solution: integrating state of the art laser applications with process automation and system validation. By utilizing the wide range of lasers and imaging optics developed by Control Micro Systems we frequently provide our customers with exceptional processing performance and we never lose sight of the ultimate goal of your interest in laser technology… improved productivity and lower costs. As such with wafer processing; serialization for traceability, scribing and lapping wafers we offer a range of solutions tailored for your specific requirements. When determining the system offerings we take into account that it must meet many processing requirements such as geometries, dimensions, line width, slag tolerances, and clean room protocol. In addition substrates:  silicon, sapphire, compounds (GaAS, InP, SiCO2, SiGe etc.), crystal wafers (LiTaO3 and LiNbO3) or photo resist exposing; of course, handling needs and throughput must be considered when offering the best solution for your needs.

Some examples of the systems offered and their benefits include:

  • The UV Laser System (355nm or 266nm)offers the best solution when process tolerances are the most important deciding factor.  This system allows geometries and line widths below 5 micron in dimensions and processing with minimal to no slag. This system also reduces particulate generation such that it is acceptable for today’s most stringent clean room protocol.
  • The 532 UV Laser System offers a solution including reduced line width in regards to the above offerings; in the 15 micron range.  In addition, the 532 System offers deeper etch capabilities at a lower power in regards to the 355 UV System.
  • The Fiber Laser System provides solutions where tighter tolerances are required. These systems also produce less particulate than the CO2 Laser System and thus are acceptable for standard fabrication clean room in the Class 100 range.  These systems also can provide deeper scribe lines at a lower power than the 532 System and 355 System described above should scribing and lapping be desired.
  • The CO 2 Laser System offers an economical solution suitable for serialization and dicing for use in higher class clean rooms, when larger geometries and line widths are acceptable and slag is not a major concern. A benefit for the CO2 Laser System is that it will allow for a deeper scribe line with a single laser pass in relation to the other systems offerings.

Download our Semiconductor Wafer Marking System Data Sheet


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