CMS Laser, the leader in CO2 laser glass etching technology, designs and builds industrial turnkey laser systems to etch both Automotive Glass Engraving and other kinds of glass. We use our own optics, hardware, laser control circuits and marking software to achieve state-of-the-art etching of logos, trademarks, date codes and 2Dmatrix codes that, tests have proven, do not adversely affect the strength of the glass after marking.
The benefits of laser etching over conventional methods are significant. The laser requires no consumables and leaves no mess or hazards to clean up. No masks are required - changes to trademarks or images are just a few keystrokes away. DXF or PCX formatted graphics can be imported directly into the system and CMS Laser's LaserGraf© software lets you switch between standard or reverse image etching within seconds.
Integrating the pulsing capability of the laser with a pair of ultra-fast, high resolution galvanometers,CMS Laser achieves a marking speed and a mark quality that far surpasses dot matrix laser markers.
There are no external moving parts on the CMS Laser system. We move the laser beam (like a pencil on paper) instead of moving the entire marking head like first generation laser etching systems do.
That not only eliminates the bulky, expensive XY slides and electric motors needed to move the head, it also cuts down on maintenance costs and makes the etching process a whole lot faster! If you'd like to know more about the best glass-marking system available, send some samples of your glass to our lab for processing. Click here for an Applications Request Form. We'll return your laser-marked samples with a complete report on the technical feasibility of your particular application and the level of performance you can expect from our system.
Of course, we'll be happy to quote you for a simple 'drop-in' system or a turnkey solution complete with conveyors and pick-and-place assemblies to satisfy all of your processing needs.
For more information, please contact our Sales Department.