Laser Wafer & Die Processing Equipment

Introducing to you our latest laser wafer marking system equipment from Control Micro Systems.

At Control Micro Systems we combine our years of experience with a variety of disciplines to provide a turn-key solution: integrating state of the art laser applications with process automation and system validation. By utilizing the wide range of lasers and imaging optics developed by Control Micro Systems we frequently provide our customers with exceptional processing performance and we never lose sight of the ultimate goal of your interest in laser technology… improved productivity and lower costs. As such with wafer processing; serialization for traceability, scribing and lapping wafers we offer a range of solutions tailored for your specific requirements.  When determining the system offerings we take into account that it must meet many processing requirements such as geometries, dimensions, line width, slag tolerances, and clean room protocol. In addition substrates:  silicon, sapphire, compounds (GaAS, InP, SiCO_2, SiGe etc.), crystal wafers (LiTaO₃ and LiNbO₃) or photo resist exposing; of course, handling needs and throughput must be considered when offering the best solution for your needs.

Advantages of the laser wafer marking systems include:

• The UV Laser System (355nm or 266nm) offers the best solution when process tolerances are the most important deciding factor.

• The 532 Laser UV System offers a solution including reduced line width in regards to the above offerings; in the 15 micron range.

• The Fiber Laser System provides solutions where tighter tolerances are required.

• The CO₂ Laser System offers an economical solution suitable for serialization and dicing for use in higher class clean rooms, when larger geometries and line widths are acceptable and slag is not a major concern.

For complete list of benefits for the silicon | sapphire wafer marks and insights into our new innovative laser wafer equipment visit waferserialization.com.

Need more information on wafer marking?  Contact us today for a complimentary feasibility study on laser marking your parts! 407-679-9716 | Contact Us | http://www.cmslaser.com.